| 摘要 |
PROBLEM TO BE SOLVED: To improve performance of a solid state image element which is formed by performing division exposure in which the whole chip is processed by a plurality of exposures, and in which each of a plurality of pixels arranged in a pixel array part has a plurality of photo diodes.SOLUTION: In the division exposure which is performed during manufacturing of a solid state image element, a border line DL dividing an exposure region is specified so as to be positioned between a photodiode PD1 and a photodiode PD2 arrayed in a first direction in an active region AR of a pixel PE2, and also specified so as to be along a second direction orthogonal to the first direction. |
