发明名称 COOLING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a cooling device which enables improvement of thermal responsiveness and stable refrigerant circulation.SOLUTION: A cooling device according to one embodiment includes: a heat receiving part; a heat radiation part; a first passage; a second passage; and a heat storage material. The heat receiving part has a heat receiving surface on which a heating element is installed and boils a refrigerant enclosed therein. The heat radiation part is disposed above the heat receiving part and radiates heat from the refrigerant. The first passage connects the heat receiving part with the heat radiation part and circulates the refrigerant, which is boiled in the heat receiving part and thereby rises, toward the heat radiation part. The second passage connects the heat receiving part with the heat radiation part and circulates the refrigerant, from which heat is radiated in the heat radiation part, to the heat receiving part. The heat storage material is disposed at the downstream side relative to the heat radiation part in a refrigerant circulation direction.
申请公布号 JP2015230907(A) 申请公布日期 2015.12.21
申请号 JP20140114921 申请日期 2014.06.03
申请人 TOSHIBA CORP 发明人 TSUKINARI YUKI;KOYAMA YASUHEI;KOTANI KAZUYA
分类号 H05K7/20;F28D15/02 主分类号 H05K7/20
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