发明名称 CMP POLISHING LIQUID
摘要 PROBLEM TO BE SOLVED: To provide a CMP polishing liquid for polishing at high speed a non-oxide single crystal substrate high in hardness and chemical stability such as a silicon carbide single crystal substrate and making a surface property smooth and excellent in atom level of a crystal.SOLUTION: The CMP polishing liquid contains a polishing agent, an oxidant containing a transition metal having an oxidation reduction potential of 0.5 V or more and a dispersant, polishing particles (10) used for the polishing agent is a particle having a core shell structure, a core layer (2) contains oxide of at least one element selected from Al, Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Ge, Zr, In, Sn, Y, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, W, Bi, Th and an alkali earth metal and a shell layer (4) contains cerium oxide.
申请公布号 JP2015229750(A) 申请公布日期 2015.12.21
申请号 JP20140117581 申请日期 2014.06.06
申请人 KONICA MINOLTA INC 发明人 OKUYAMA OKUSHI;GOAN KAZUYOSHI;FUJITA MICHIYO;HARADA MARUO;FUJIEDA YOICHI
分类号 C09K3/14;B24B37/00;C09G1/02;H01L21/304 主分类号 C09K3/14
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