发明名称 PLATING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a plating device.SOLUTION: A plating device comprises: a plating tank to accommodate an object to be plated; a support frame provided to the plating tank to support the object to be plated; and a weight part coupled to the support frame to apply tension to the object to be plated by its own weight.
申请公布号 JP2015229801(A) 申请公布日期 2015.12.21
申请号 JP20140143871 申请日期 2014.07.14
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 ROH YOUJUNG;KIM CHULKYU
分类号 C25D17/08;C25D7/00 主分类号 C25D17/08
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