发明名称 |
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To solve a problem to satisfy both of low resistance of a gate electrode and prevention of boron diffusion to a semiconductor substrate.SOLUTION: A semiconductor device comprises: a semiconductor substrate in which a trench is provided; a gate insulation film provided along a surface of the trench; a barrier film which is provided along a surface of the gate insulation film in the trench and restricts transmission of boron; a metallic crystal nucleus film which is provided along a surface of the barrier film in the trench and contains boron; and a metal film embedded in the trench on the metallic crystal nucleus film. |
申请公布号 |
JP2015231025(A) |
申请公布日期 |
2015.12.21 |
申请号 |
JP20140117829 |
申请日期 |
2014.06.06 |
申请人 |
MICRON TECHNOLOGY INC |
发明人 |
SHINDO HIDEKAZU |
分类号 |
H01L29/423;H01L21/28;H01L21/285;H01L21/3205;H01L21/336;H01L21/768;H01L21/8242;H01L23/522;H01L23/532;H01L27/108;H01L29/41;H01L29/49;H01L29/78 |
主分类号 |
H01L29/423 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|