发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
摘要 PROBLEM TO BE SOLVED: To solve a problem to satisfy both of low resistance of a gate electrode and prevention of boron diffusion to a semiconductor substrate.SOLUTION: A semiconductor device comprises: a semiconductor substrate in which a trench is provided; a gate insulation film provided along a surface of the trench; a barrier film which is provided along a surface of the gate insulation film in the trench and restricts transmission of boron; a metallic crystal nucleus film which is provided along a surface of the barrier film in the trench and contains boron; and a metal film embedded in the trench on the metallic crystal nucleus film.
申请公布号 JP2015231025(A) 申请公布日期 2015.12.21
申请号 JP20140117829 申请日期 2014.06.06
申请人 MICRON TECHNOLOGY INC 发明人 SHINDO HIDEKAZU
分类号 H01L29/423;H01L21/28;H01L21/285;H01L21/3205;H01L21/336;H01L21/768;H01L21/8242;H01L23/522;H01L23/532;H01L27/108;H01L29/41;H01L29/49;H01L29/78 主分类号 H01L29/423
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