发明名称 SUBSTRATE PROCESSING MODULE
摘要 PROBLEM TO BE SOLVED: To provide a substrate processing device and a substrate processing unit in which maintenance work during substrate damage is facilitated.SOLUTION: A substrate processing device is provided including: substrate processing units (201A, 205A) which are provided in a housing (11) where an opening (50a) is formed at a part of a bottom surface (50) and which process a substrate (W); and a foreign matter capture part (60) which is connected to the opening (50a) and which catches foreign matter derived from the substrate (W).
申请公布号 JP2015230940(A) 申请公布日期 2015.12.21
申请号 JP20140115606 申请日期 2014.06.04
申请人 EBARA CORP 发明人 AONO HIROSHI;SONE CHUICHI;AIZAWA HIDEO;SHINKAI TAKESHI
分类号 H01L21/683;H01L21/304 主分类号 H01L21/683
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