发明名称 LAMINATE, LAMINATED PLATE AND PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a laminate having good glass adhesion property and excellent chemical resistance and to provide a laminated plate and a printed wiring board using the same.SOLUTION: There is provided: a laminate having one or more resin layers ans one or more glass substrate layers, where a resin composition constituting the resin layers is a laminate containing a thermosetting resin obtained by reacting at least one resin (a) selected from a polybutadiene resin having a reactive substituent at the terminal and a hydrogenated polybutadiene resin, a compound (b) having at least two cyanate groups in one molecule and a compound (c) having at least two epoxy groups in one molecule; and a laminated plate and a printed wiring board using the same.
申请公布号 JP2015229286(A) 申请公布日期 2015.12.21
申请号 JP20140116278 申请日期 2014.06.04
申请人 HITACHI CHEMICAL CO LTD 发明人 ISHIKURA KUMIKO;YAMAZAKI YUKA;IZUMI HIROYUKI;SHIMAZAKI TOSHIKATSU;MURAI HIKARI
分类号 B32B17/10;H05K3/46 主分类号 B32B17/10
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