SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE HAVING THE SAME AND METHOD OF MANUFACTURING THE SAME

摘要

According to exemplary embodiments of the present invention, a semiconductor package comprises: a substrate having a plurality of connection pads; and a first semiconductor chip stacked on the substrate. The first semiconductor package chip comprises: a first semiconductor chip body having a first surface and a second surface facing the first surface; a first connection pad arranged on the first surface of the first semiconductor chip body; and a first rewiring pad arranged on the first surface of the first semiconductor chip body, electrically connected to the first connection pad, and having one end unit extended to an outer surface of the first semiconductor chip body with an uneven structure. Since the rewiring pad has the uneven structure in the one end unit, the electrical connection reliability can be increased when connecting a connection pad and a rewiring pad of the substrate with a conductive line.