| 摘要 |
PROBLEM TO BE SOLVED: To provide a processing method of a wafer capable of dividing a wafer appropriately while preventing pollution due to the adhesive layer of an adhesive tape.SOLUTION: A processing method of a wafer includes a tape sticking step for sticking a first adhesive tape (21) to the surface (11a) of a wafer (11), a groove formation step for forming a cutting groove (27) and a residual part (29) in the wafer by cutting a cutting blade (6) from the backside (11b) of the wafer along a division line (17), a re-sticking step for sticking a second adhesive tape (31) to the backside of the wafer and peeling the first adhesive tape from the wafer surface, and a division step for cutting the wafer surface with a cutting blade (14) along a division line, and dividing the wafer into device chips by cutting the residual part. The first adhesive tape is stuck to the wafer in a disposed adhesive layer (25) excepting the region corresponding to the device region (13) of the wafer. |
