发明名称 |
ETCHING RESIST MATERIAL AND METHOD OF MANUFACTURING PRINTED WIRING BOARD |
摘要 |
PROBLEM TO BE SOLVED: To provide an etching resist material that enables a printed wiring board which has a low defective fraction and is rich in reliability to be manufactured at low cost, and a method of manufacturing the printed wiring board.SOLUTION: There is provided an etching resist material consisting of an imidazole compound having a (meth) acryloyl group. The method of manufacturing a printed wiring board includes: a process of forming a protective film on a surface of copper by bringing the etching resist material into contact with a copper-clad laminate; a process of irradiating the protective film with an active energy ray; a process of etching copper which does not have the protective film formed on the surface; and a process of removing the protective film. |
申请公布号 |
JP2015227499(A) |
申请公布日期 |
2015.12.17 |
申请号 |
JP20140114489 |
申请日期 |
2014.06.03 |
申请人 |
SHIKOKU CHEM CORP |
发明人 |
MIYAZAKI MASAYUKI;OKUMURA NAOTO;IKEDA YUICHI;HIRAO HIROHIKO |
分类号 |
C23C22/52;C08F20/34;C23F1/02;H05K3/06 |
主分类号 |
C23C22/52 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|