发明名称 ETCHING RESIST MATERIAL AND METHOD OF MANUFACTURING PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide an etching resist material that enables a printed wiring board which has a low defective fraction and is rich in reliability to be manufactured at low cost, and a method of manufacturing the printed wiring board.SOLUTION: There is provided an etching resist material consisting of an imidazole compound having a (meth) acryloyl group. The method of manufacturing a printed wiring board includes: a process of forming a protective film on a surface of copper by bringing the etching resist material into contact with a copper-clad laminate; a process of irradiating the protective film with an active energy ray; a process of etching copper which does not have the protective film formed on the surface; and a process of removing the protective film.
申请公布号 JP2015227499(A) 申请公布日期 2015.12.17
申请号 JP20140114489 申请日期 2014.06.03
申请人 SHIKOKU CHEM CORP 发明人 MIYAZAKI MASAYUKI;OKUMURA NAOTO;IKEDA YUICHI;HIRAO HIROHIKO
分类号 C23C22/52;C08F20/34;C23F1/02;H05K3/06 主分类号 C23C22/52
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