PACKAGED SEMICONDUCTOR COMPONENTS HAVING SUBSTANTIALLY RIGID SUPPORT MEMBERS AND METHODS OF PACKAGING SEMICONDUCTOR COMPONENTS

摘要

Packaged semiconductor components having substantially rigid support member are disclosed. The packages can include a semiconductor die and a support member proximate to the semiconductor die. The support member is at least substantially rigid. The packages can further include an adhesive between the support member and the semiconductor die and adhesively attaching the support member to the semiconductor die. The packages can also include a substrate carrying the semiconductor die and the support member attached to the semiconductor die.

主权项

1. A system, comprising:
at least one of a processor and memory device, and wherein at least one of the processor and the memory device includes a semiconductor component comprising a semiconductor die; a support member attached to the semiconductor die, the support member being at least substantially rigid and having a composition different from a composition of the semiconductor die; and a substrate carrying the semiconductor die and the support member attached to the semiconductor die.