发明名称 ENDPOINTING DETECTION FOR CHEMICAL MECHANICAL POLISHING BASED ON SPECTROMETRY
摘要 Methods and apparatus for spectrum-based endpointing. An endpointing method includes selecting a reference spectrum. The reference spectrum is a spectrum of white light reflected from a film of interest on a first substrate and has a thickness greater than a target thickness. The reference spectrum is empirically selected for particular spectrum-based endpoint determination logic so that the target thickness is achieved when endpoint is called by applying the particular spectrum-based endpoint logic. The method includes obtaining a current spectrum. The current spectrum is a spectrum of white light reflected from a film of interest on a second substrate when the film of interest is being subjected to a polishing step and has a current thickness that is greater than the target thickness. The method includes determining, for the second substrate, when an endpoint of the polishing step has been achieved. The determining is based on the reference and current spectra.
申请公布号 US2015364390(A1) 申请公布日期 2015.12.17
申请号 US201514832997 申请日期 2015.08.21
申请人 APPLIED MATERIALS, INC. 发明人 Benvegnu Dominic J.;David Jeffrey Drue;Swedek Boguslaw A.
分类号 H01L21/66;H01L21/3105;H01L21/321;H01L21/306 主分类号 H01L21/66
代理机构 代理人
主权项
地址 Santa Clara CA US