WAFER PROCESSING METHOD

摘要

Disclosed herein is a wafer processing method including a wafer supporting step of mounting an adhesive film for die bonding on the back side of a wafer, attaching a dicing tape to the adhesive film, and supporting the peripheral portion of the dicing tape to an annular frame, wherein the wafer has already been divided into individual device chips along division lines formed on the front side or a break start point has already been formed inside the wafer along each division line, a protective film forming step of applying a water-soluble resin to the front side of the wafer and/or the peripheral portion of the adhesive film projecting from the outer circumference of the wafer, thereby forming a protective film from the water-soluble resin, and an adhesive film breaking step of expanding the dicing tape to thereby break the adhesive film along the individual device chips.

主权项

1. A wafer processing method of dividing a wafer into a plurality of individual device chips along a plurality of crossing division lines and mounting an adhesive film for die bonding on a back side of each device chip, said plurality of crossing division lines being formed on a front side of said wafer to thereby define a plurality of separate regions where a plurality of devices are respectively formed, said wafer processing method comprising:
a wafer supporting step of mounting said adhesive film on a back side of said wafer, attaching a dicing tape to said adhesive film, and supporting a peripheral portion of said dicing tape to an annular frame, wherein said wafer has already been divided along said division lines or a break start point has already been formed inside said wafer along each division line; a protective film forming step of applying a water-soluble resin to the front side of said wafer and/or a peripheral portion of said adhesive film projecting from an outer circumference of said wafer, thereby forming a protective film from said water-soluble resin; and an adhesive film breaking step of expanding said dicing tape to thereby break said adhesive film along said individual device chips after performing said protective film forming step.