发明名称 Laser Welding Apparatus and Laser Welding Method
摘要 A laser welding apparatus that welds a butted interface of a workpiece by laser light irradiation while successively feeding the workpiece having the butted interface to a welding position includes an X- and Y-axis scanner that scans laser light outputted from a laser light source in an X-axis direction and a Y-axis direction which are orthogonal to each other, a measuring device that measures a dimension along the butted interface, and a scanner control device that controls driving of the X- and Y-axis scanner so as to weld the butted interface by laser light irradiation.
申请公布号 US2015360319(A1) 申请公布日期 2015.12.17
申请号 US201514832275 申请日期 2015.08.21
申请人 Furukawa Electric Co., Ltd. ;Furukawa Automotive Systems Inc. 发明人 YAGI Saburo;SHIGEMATSU Takashi;SATOU Masaya;KOJIMA Shinya
分类号 B23K26/20;B23K26/08;G01B11/14;B23K26/30 主分类号 B23K26/20
代理机构 代理人
主权项 1. A laser welding apparatus adapted to weld a butted interface and a lapped portion constituting a crimp portion of a crimp terminal by laser light irradiation while successively feeding the crimp terminal to a welding position, the crimp portion having the butted interface where opposite ends of a plate material bent into a tubular shape are butted and the lapped portion where the plate material is lapped in a planar manner, the laser welding apparatus comprising: a measuring device adapted to measure, for the crimp terminal, a dimension of a gap at the butted interface and a dimension of a gap between an upper surface and a lower surface at the lapped portion; a holding mechanism adapted to hold the crimp portion of the measured crimp terminal at a predetermined position and orientation at the welding position; an X- and Y-axis scanner adapted to scan laser light outputted from a laser light source in an X-axis direction and a Y-axis direction which are orthogonal to each other; and a scanner control device adapted to control driving of the X- and Y-axis scanner so as to weld the butted interface and the lapped portion constituting the crimp portion by laser light irradiation, laser light irradiation being performed while the crimp portion is held by the holding mechanism.
地址 Tokyo JP