| 主权项 |
1. A semiconductor device, comprising:
a package interface including N numbers of first group of data balls which are disposed on a first side thereof, N numbers of second group of data balls which are disposed on a second side thereof, and M numbers of command/address balls which are disposed between the first side and the second side; a first semiconductor chip which is stacked on the first side over the package interface, and includes 2N numbers of first group of data pads and M numbers of first command/address pads; and a second semiconductor chip which is stacked on the second side over the package interface, and includes 2N numbers of second group of data pads and M numbers of second command/address pads, wherein M numbers of the first command/address pads and M numbers of the second command/address pads are commonly coupled with M numbers of the command/address balls, wherein a half of 2N numbers of the first group of data pads are coupled with N numbers of the first group of data balls, and wherein a half of 2N numbers of the second group of data pads are coupled with N numbers of the second group of data balls. |
