| 发明名称 |
SILICON SHIELD FOR PACKAGE STRESS SENSITIVE DEVICES |
| 摘要 |
A surface mount semiconductor package, semiconductor device, and method for fabrication of the surface mount semiconductor package and electrical device are described that include a leadframe assembly, an integrated circuit device disposed on the leadframe assembly, a silicon shield disposed on the integrated circuit device, where the silicon shield is configured to mitigate packaging stress to the integrated circuit device, and a molding layer that encapsulates the integrated circuit device, the silicon shield, and at least a portion of the leadframe assembly. |
| 申请公布号 |
US2015364431(A1) |
申请公布日期 |
2015.12.17 |
| 申请号 |
US201414497707 |
申请日期 |
2014.09.26 |
| 申请人 |
Maxim Integrated Products, Inc. |
发明人 |
Cheng Ming;Wang Ken;Tian Tian;Ayyash Mohammad;Pham Tuyen;Rush Brian |
| 分类号 |
H01L23/00;H01L23/29;H01L23/31;H01L23/495 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A surface mount semiconductor package, comprising:
a leadframe assembly; an integrated circuit device disposed on the leadframe assembly; a silicon shield disposed on the integrated circuit device, where the silicon shield is configured to mitigate packaging stress to the integrated circuit device; and a molding layer that encapsulates the integrated circuit device, the silicon shield, and at least a portion of the leadframe assembly. |
| 地址 |
San Jose CA US |
