ELECTRONIC DEVICE WITH DIE BEING SUNK IN SUBSTRATE

摘要

An electronic device includes a circuit integrated on a die having front and back surfaces with die terminals on the front surface. The die is embedded in a package including substrate of thermally conductive material with front and back surfaces and a through-hole. The die is sunk in the through-hole. A first insulating material layer covers the die front surface and the package front surface with first windows for accessing die terminals. Package terminals and package track are arranged on the first insulating layer. A second insulating material layer covers the first insulating layer and the package tracks with second windows for accessing the package terminals.

主权项

1. An electronic device, comprising:
at least one circuit being integrated on a die, the die having a die front surface and a die back surface opposed to each other and one or more die terminals on the die front surface for accessing the integrated circuit; a package including a package substrate of thermally conductive material having a package front surface and a package back surface opposed to each other and at least one through-hole crossing the package substrate between the package front surface and the package back surface; wherein the die is sunk in the through-hole with the die front surface and the die back surface in correspondence to the package front surface and to the package back surface, respectively; a first insulating layer of electrically insulating material covering the die front surface and the package front surface with one or more first windows each one for accessing a corresponding one of the die terminals; one or more package terminals; one or more package tracks of electrically conductive material arranged on the first insulating layer, each package track coupling a corresponding one of the package terminals with at least a corresponding one of the die terminals; and a second insulating layer of electrically insulating material covering the first insulating layer and the package tracks with one or more second windows each one for accessing a corresponding one of the package terminals.