Integrated Circuit Packages and Methods of Forming Same

摘要

Integrated circuit packages and methods of forming the same are disclosed. A first die is mounted on a first side of a package substrate. A heat dissipation feature is attached on a first side of the first die. A second die is mounted on a second side of the first die, wherein the second die is at least partially disposed in a through hole formed in the package substrate. An encapsulant is formed on the first side of the package substrate around the first die.

主权项

1. A method comprising:
attaching a workpiece to a heat dissipation feature; mounting the workpiece on a first side of a package substrate, the package substrate comprising a through hole, wherein the heat dissipation feature is not directly attached to the package substrate; forming a first encapsulant on the first side of the package substrate, wherein the first encapsulant surrounds the workpiece; and mounting a die stack to the workpiece, the die stack comprising one or more integrated circuit dies, wherein the die stack is at least partially disposed in the through hole of the package substrate.