CHIP ON FILM SUBSTRATE, MANUFACTURING METHOD THEREFOR, AND DISPLAY PANEL

摘要

A chip on film substrate comprising: a substrate (10); a soldering lead (20) provided on the surface of the substrate (10); a protective layer (30) provided at a predetermined position on the soldering lead (20); a metal thin-film protective layer (40) provided on the soldering layer (20) not coated with the protective layer (30). By coating a reactive metal thin-film protective layer onto the soldering lead (20) partly exposed in air on the chip on film substrate, the corrosion of copper is deferred and the corrosion rate of copper is slowed, thus reducing the risk of the soldering lead (20) on the chip on film substrate being corroded and thus fructured.