| 摘要 |
The present invention relates to a method for reproducing a waste slurry generated when a semiconductor/solar power wafer is fabricated and, more specifically, to a method for reproducing silicon (Si) in a fine powder state which is included in a cutting powder of a waste slurry. According to an embodiment of the present invention, the method for reproducing a waste slurry comprises: a mixing step of mixing a waste slurry in which at least cutting material in a fine powder state and silicon in a fine powder state are mixed, with a specific gravity separation liquid; a stirring step of stirring the waste slurry mixed with the specific gravity separation liquid; a centrifugation step of performing centrifugation such that at least the cutting material, silicon in a fine powder state, and specific gravity separation liquid are layer-separated in the stirred waste slurry by specific gravity differences, and a cutting material having a relatively large weight is removed therefrom; and a separation-extraction step of separating and extracting the silicon in a fine powder state from a specific separation liquid remaining in the centrifugation step. |
