CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, SEMICONDUCTOR SEALING MATERIAL, SEMICONDUCTOR DEVICE, PREPREG, CIRCUIT BOARD, BUILDUP FILM, BUILDUP BOARD, FIBER-REINFORCED COMPOSITE MATERIAL, AND FIBER-REINFORCED RESIN MOLDED ARTICLE

摘要

Provided is a curable resin composition, and the like, having superior fluidity and superior cured produced properties, such as heat resistance, moisture and solder resistance, flame resistance, and dielectric properties. The curable resin composition comprises a resin (A) having the benzoxazine structure represented by structural formula (A1) and epoxy resin (B), wherein when α is the total number of moles of the benzoxazine structure in structural formula (A1) and β is the number of moles of epoxy groups in epoxy resin (B), the ratio [β/α] is 0.1 to 0.5.