| 摘要 |
A floor cleaning machine having a movable adjustment element, a suction foot, a cleaning head and a drive. The adjustment element is coupled to the cleaning head, the suction foot and the drive. The drive is configured to move the adjustment element between a first position, in which the cleaning head and suction foot are raised, a second position, in which the cleaning head is raised and the suction foot is lowered, and a third position in which the cleaning head and suction foot are lowered. |
| 主权项 |
1. A floor cleaning machine comprising:
a machine frame (3), a chassis mounted on the machine frame (3), the chassis being adapted for moving the floor cleaning machine (1) over a floor area (7) that is to be cleaned, a cleaning head (13) that is height-adjustably secured to the machine frame (3) for movement between an engagement position, in which the cleaning head (13) engages with the floor area floor area (7), and a raised head position, a suction foot (23), which is adapted to suction fluid from the floor area (7), the suction foot being height-adjustably secured to the machine frame for movement between a contact position, in which the suction foot (23) rests on the floor area (7), and a raised foot position, a movable adjustment element (43), which is coupled to the cleaning head (13) and to the suction foot (23), and a drive (39), which is selectively operable to move the adjustment element (43) between a first position, a second position and a third position, wherein, when the adjustment element (43) is in the first position, the cleaning head (13) is raised out of the engagement position and the suction foot (23) is raised out of the contact position, wherein, when the adjustment element (43) is in the second position, the cleaning head (13) is raised out of the engagement position and the suction foot (23) is lowered into the contact position and wherein, when the adjustment element (43) is in the third position, the cleaning head (13) is lowered into the engagement position, and the suction foot (23) is lowered into the contact position. |
