| 摘要 |
A three dimensional headphone cushion configured for attachment to a headphone is provided. The three dimensional headphone cushion includes an inner circumferential wall. An outer circumferential wall opposes the inner circumferential wall. A center segment is formed between the inner and outer circumferential walls. An inner passage is defined by the inner circumferential wall and is configured to allow passage of sound generated by the headphones. The three dimensional headphone cushion is formed from a biodegradable, visco-elastic, polymeric-based open cell foam material. |
