| 摘要 |
PROBLEM TO BE SOLVED: To provide an integrated circuit package including an enclosure which includes an insulation housing, a first electrical contact, and a second electrical contact.SOLUTION: An insulation housing, a first electrical contact, and a second electrical contact are configured to form a contact surface of an enclosure. Moreover, the first and second contacts have size which is substantially less affected by an alignment related to an electromechanical connection to corresponding contacts of an end-use device. The enclosure encloses an integrated circuit die electrically connected to the first and second electrical contacts. The first and second electrical contact which are less affected by the alignment may be electromechanically connected to the corresponding contacts of the end-use device (e.g., a printer). Further, an integrated circuit package may be hosted by a peripheral device (e.g., a printer cartridge). |
