发明名称 DEPOSITION METHOD OF SiCN FILM
摘要 PROBLEM TO BE SOLVED: To provide a deposition method of an SiCN film which enables an SiCN film to be deposited while maintaining a good deposition rate even when a deposition temperature is lowered.SOLUTION: In a deposition method of an SiCN film, an SiCN film is deposited on a processed surface of a processed object. The deposition method of the SiCN film includes: a step 1 where an Si material gas containing an Si material is supplied to a processing chamber in which the processed object is stored; and a step 3 where a gas containing a nitriding agent is supplied to the processing chamber after the step 1 where the Si material gas is supplied. A 1, 2, 3-triazole-based compound is used as the nitriding agent.
申请公布号 JP2015228391(A) 申请公布日期 2015.12.17
申请号 JP20140112439 申请日期 2014.05.30
申请人 TOKYO ELECTRON LTD;UBE IND LTD 发明人 SHIMIZU AKIRA;MIYAHARA TAKAHIRO;SHIRAI MASASHI;SADAIKE SHINICHIRO
分类号 H01L21/314;C23C16/42;C23C16/44;C23C16/455;H01L21/31;H01L21/318 主分类号 H01L21/314
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