发明名称 |
DEPOSITION METHOD OF SiCN FILM |
摘要 |
PROBLEM TO BE SOLVED: To provide a deposition method of an SiCN film which enables an SiCN film to be deposited while maintaining a good deposition rate even when a deposition temperature is lowered.SOLUTION: In a deposition method of an SiCN film, an SiCN film is deposited on a processed surface of a processed object. The deposition method of the SiCN film includes: a step 1 where an Si material gas containing an Si material is supplied to a processing chamber in which the processed object is stored; and a step 3 where a gas containing a nitriding agent is supplied to the processing chamber after the step 1 where the Si material gas is supplied. A 1, 2, 3-triazole-based compound is used as the nitriding agent. |
申请公布号 |
JP2015228391(A) |
申请公布日期 |
2015.12.17 |
申请号 |
JP20140112439 |
申请日期 |
2014.05.30 |
申请人 |
TOKYO ELECTRON LTD;UBE IND LTD |
发明人 |
SHIMIZU AKIRA;MIYAHARA TAKAHIRO;SHIRAI MASASHI;SADAIKE SHINICHIRO |
分类号 |
H01L21/314;C23C16/42;C23C16/44;C23C16/455;H01L21/31;H01L21/318 |
主分类号 |
H01L21/314 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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