COPPER FOIL WITH CARRIER, PRINTED WIRING BOARD, COPPER-CLAD LAMINATE, ELECTRONIC APPARATUS, MANUFACTURING METHOD OF COPPER FOIL WITH CARRIER, AND MANUFACTURING METHOD OF PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a copper foil with a carrier, with the occurrence of a copper residue larger than the circuit width of a specified circuit well inhibited, the circuit being formed on an ultrathin copper layer after detachment of a carrier laminated on a resin substrate for removal.SOLUTION: A copper foil with a carrier includes a carrier, an intermediate layer, and an ultrathin copper layer in this order. The surface of the carrier on the side of the ultrathin copper layer has stripe-like projections having an average height of 2.0 μm or less at a maximum.