发明名称 LAYERED ASSEMBLIES
摘要 An assembly structure is formed of generally rigid layers of material bonded to generally flexible layers so as to form apparatus including hinges, bearings, and other translating and rotating subunits along with embedded functional devices.
申请公布号 US2015366113(A1) 申请公布日期 2015.12.17
申请号 US201514834336 申请日期 2015.08.24
申请人 SREETHARAN Pratheev Sabaratnam 发明人 SREETHARAN Pratheev Sabaratnam
分类号 H05K13/00;H05K5/02;E05D1/00 主分类号 H05K13/00
代理机构 代理人
主权项 1. A method of forming a μMECS™ electro-mechanical device including a further device comprising: providing a first relatively rigid layer of material; removing a portion of said first relatively rigid layer of material to define first and second peripheral edges having first and second relatively rigid members therewithin, said first and second relatively rigid members having respective first and second upper surface regions disposed generally coplanar to one another; providing a second relatively flexible layer of material having third and fourth surface regions, said third and fourth surface regions disposed in generally parallel space relation to one another; coupling said first and second surface regions to respective first and second portions of said fourth surface region, wherein said first and second portions are disposed in generally planar space relation to one another with a third portion of said fourth region disposed there between such that, upon separation of said first and second members from said first relatively rigid layer, said first and second members may be flexibly reoriented with respect to one another; and coupling said further device to at least one of said second relatively flexible layer and said first and second members, said further device including at least one of an electrical device, an electronic device, a photonic device, a nuclear device, an optical device, an electro-optical device, a chemical device, an electrochemical device, a microwave device, a terahertz device, an infrared device, a cooling device, a heating device, and actuator, a transducer, an electromechanical device, an electrical conductor, an optical conductor, a thermal conductor, a waveguide, a passive device, an active device, and combinations thereof.
地址 Cambridge MA US