| 发明名称 |
PRINTED WIRING BOARD |
| 摘要 |
A printed wiring board includes a first circuit board having a first surface and a second surface on the opposite side with respect to the first surface, and a second circuit board having a third surface and a fourth surface on the opposite side with respect to the third surface and having a mounting area on the third surface of the second circuit board.;The first circuit board is laminated on the third surface of the second circuit board such that the first surface of the first circuit board faces the third surface of the second circuit board, and the first circuit board includes reinforcing material and has an opening portion exposing the mounting area of the second circuit board. |
| 申请公布号 |
US2015366062(A1) |
申请公布日期 |
2015.12.17 |
| 申请号 |
US201514741122 |
申请日期 |
2015.06.16 |
| 申请人 |
IBIDEN CO., LTD. |
发明人 |
NODA Kota;Furusawa Takeshi |
| 分类号 |
H05K1/14;H05K1/11;H05K1/03;H05K1/02 |
主分类号 |
H05K1/14 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A printed wiring board, comprising:
a first circuit board having a first surface and a second surface on an opposite side with respect to the first surface; and a second circuit board having a third surface and a fourth surface on an opposite side with respect to the third surface and having a mounting area on the third surface of the second circuit board, wherein the first circuit board is laminated on the third surface of the second circuit board such that the first surface of the first circuit board faces the third surface of the second circuit board, and the first circuit board comprises reinforcing material and has an opening portion exposing the mounting area of the second circuit board. |
| 地址 |
Ogaki-shi JP |
