An electrical device includes a housing having at least one wall defining a cavity. A circuitry substrate is disposed within the cavity with at least one electronic component disposed on and extending from the circuitry substrate. A pottant is disposed within the cavity for encasing the circuitry substrate and the electronic component within the cavity. An insert is coupled to the housing within the cavity. The insert displaces the pottant for minimizing an amount of the pottant required to encase the circuitry substrate and the electronic component. A method of manufacturing the electrical device is also disclosed.
