摘要 |
Product ICs/wafers include additional diagnostic, test, or monitoring structures opportunistically placed in filler cell positions, within tap cells, within decap cells, within scribe line areas, and/or within dummy fill regions. Improved fabrication processes utilize data from such structure (s) in wafer disposition decisions, rework decisions, process control, yield learning, or fault diagnosis. |
申请人 |
PDF SOLUTIONS, INC. |
发明人 |
DE, INDRANIL;CIPLICKAS, DENNIS, J.;LAM, STEPHEN;HAIGH, JONATHAN;ROVNER, VYACHESLAV, V.;HESS, CHRISTOPHER;BROZEK, TOMASZ, W.;STROLJWAS, ANDREZEJ, J.;DOONG, KELVIN;KIBARIAN, JOHN, K.;LEE, SHERRY, F.;MICHAELS, KIMON, W.;STROJWAS, MARCIN, A.;O'SULLIVAN, CONOR;JAIN, MEHUL |