| 摘要 |
PROBLEM TO BE SOLVED: To provide a die bonder and a die bonding method capable of subjecting wafers to grade treatment without removing the wafers, in a die bonder having single conveyance lane and single bonding head, or having a plurality of conveyance lanes and a plurality of bonding heads.SOLUTION: The present invention relates to a die bonder and a bonding method having single conveyance lane and single bonding head, or having a plurality of the conveyance lanes and a plurality of the bonding heads. In the die bonder and the bonding method, a classification map of a classified die is prepared, the classification map being obtained by classifying dies with different electrical characteristics included in a wafer for each of a plurality of grades, a die is picked up from the wafer to be bonded on a substrate or a die by a bonding head, and a classified substrate corresponding to the classified die is conveyed by the conveyance lane(s) for each classified substrate unit. On the basis of the classification map, classification control of bonding the classified die to the corresponding classified substrate is performed. |
