| 摘要 |
PROBLEM TO BE SOLVED: To improve a bearing force of a semiconductor chip against heat stress while inhibiting deterioration in heat dissipation properties.SOLUTION: A semiconductor device comprises: a semiconductor chip 12 which is formed by using a silicon carbide and has electrodes on one surface 12a and on a rear face opposite to the one surface; a terminal 14 which is arranged on the one surface side and connected to the electrode on the one surface side via a joint member; and a heat sink 22 which is arranged on the rear face side and connected to the electrode on the rear face side via the joint member. The one surface 12a is formed by a (0001) plane and a thickness direction of the semiconductor chip is defined as a [0001] direction. And a shortest distance L1 in a [1-100] direction among distances between an end of the square planar semiconductor chip 12 and an end of the rectangular planar terminal 14 is set shorter than a shortest distance L2 in a [11-20] direction. |
