发明名称 ORDINARY-TEMPERATURE CURABLE EPOXY RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide an ordinary-temperature curable epoxy resin composition capable of hardening quickly not only at ordinary temperature but especially at low temperatures without heating and an adhesive and a repair/reinforcement method of structure using the composition.SOLUTION: An ordinary-temperature curable epoxy resin composition comprises an ingredient (A) an epoxy resin, (B) one or more compounds selected from aliphatic polyamines, alicyclic polyamines and their modified products and (C) a complex of a boron halide and an amine compound, hardens quickly at ordinary temperature, especially in a low-temperature environmental atmosphere, like outdoors in winter, without need of heating, and secures a sufficient usable time. An injection agent, a coating and an adhesion using the composition harden in a low-temperature environmental atmosphere while securing a sufficient usable time. A repair/reinforcement method of a structure using the composition is also provided.
申请公布号 JP2015227415(A) 申请公布日期 2015.12.17
申请号 JP20140113408 申请日期 2014.05.30
申请人 KONISHI CO LTD 发明人 IGAWA SEI
分类号 C08G59/72;E01D22/00 主分类号 C08G59/72
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