POLISHING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a polishing apparatus capable of improving a polishing rate without using photocatalyst particles.SOLUTION: A polishing apparatus 1 includes: an ultraviolet irradiation device 8 to irradiate a polishing surface of a wafer 4 with ultraviolet including wavelengths of 180 nm ± 10 nm and wavelengths of 250 nm ± 10 nm through a surface plate 2; an abrasive disposed between the surface plate 2 and the wafer 4; a moving device that relatively moves the surface plate 2 and the wafer 4 and is made up of a rotary driving device 3, a base material 5, and a support disc 6; and an oxygen supply device 9 to supply oxygen between the surface plate 2 and the wafer 4.