HYBRID BONDING WITH AIR-GAP STRUCTURE

摘要

A package component includes a surface dielectric layer having a first planar surface, and a metal pad in the surface dielectric layer. The metal pad includes a diffusion barrier layer that includes sidewall portions, and a metallic material encircled by the sidewall portions of the diffusion barrier layer. The metallic material has a second planar surface level with the first planar surface. An air gap extends from the second planar surface of the metallic material into the metallic material. An edge of the air gap is aligned to an edge of the metallic material.

主权项

1. A package comprising:
a first package component comprising:
a first surface dielectric layer comprising a first planar surface; anda first metal pad in the first surface dielectric layer, wherein the first metal pad comprises:
a first diffusion barrier layer comprising sidewall portions;a first metallic material encircled by the sidewall portions of the first diffusion barrier layer, wherein the first metallic material comprises a second planar surface level with the first planar surface; andan air gap extending from the second planar surface of the first metallic material into the first metallic material; and a second package component overlapping the first package component, wherein the second package component comprises:
a second surface dielectric layer comprising a third planar surface bonded to the first planar surface; anda second metal pad in the second surface dielectric layer, wherein the second metal pad has a fourth planar surface bonded to the second planar surface, and the air gap is overlapped by the second metal pad.