| 发明名称 |
SUBSTRATE WITH ELECTRONIC DEVICE EMBEDDED THEREIN AND MANUFACTURING METHOD THEREOF |
| 摘要 |
An electronic device embedded substrate and a method of manufacturing the same are disclosed. The electronic device embedded substrate in accordance with an aspect of the present invention includes: an electronic device; and a core substrate having a cavity, in which the electronic device is embedded and of which a width of at least a portion is smaller than widths of other portions thereof. |
| 申请公布号 |
US2015366066(A1) |
申请公布日期 |
2015.12.17 |
| 申请号 |
US201414528804 |
申请日期 |
2014.10.30 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KIM Tae-Seong;YU Yeon-Seop;LEE Bok-Hee |
| 分类号 |
H05K1/18;H05K3/00;H05K3/30 |
主分类号 |
H05K1/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electronic device embedded substrate comprising:
an electronic device; and a core substrate having a cavity therein, the electronic device being embedded in the cavity, a width of at least a portion of the cavity being smaller than widths of other portions of the cavity. |
| 地址 |
Suwon-Si KR |
