发明名称 |
REFLECTED SIGNAL ABSORPTION IN INTERCONNECT |
摘要 |
Embodiments of the present disclosure are directed toward techniques and configurations for electrical signal absorption in an interconnect stub. In one instance, a printed circuit board (PCB) assembly may comprise a substrate and an interconnect (such as a via) formed in the substrate to route an electrical signal within the PCB. The interconnect may include a stub formed on the interconnect. At least a portion of the stub may be covered with an absorbing material to at least partially absorb a portion of the electric signal that is reflected by the stub. The absorbing material may be selected such that its dielectric loss tangent is greater than one, for a frequency range of a frequency of the reflected portion of the electric signal. A dielectric constant of the absorbing material may be inversely proportionate to the frequency of the reflected electric signal. Other embodiments may be described and/or claimed. |
申请公布号 |
US2015366052(A1) |
申请公布日期 |
2015.12.17 |
申请号 |
US201414303396 |
申请日期 |
2014.06.12 |
申请人 |
HUANG Shaowu;ABBOTT John J. |
发明人 |
HUANG Shaowu;ABBOTT John J. |
分类号 |
H05K1/02;H05K3/40;H05K1/11 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
1. A printed circuit board (PCB) assembly comprising:
a substrate; and at least one interconnect formed in the substrate to route an electrical signal within the PCB, wherein the interconnect includes a stub formed on the interconnect, wherein at least a portion of the stub is covered with an absorbing material to at least partially absorb a portion of the electric signal that is reflected by the stub. |
地址 |
Steilacoom WA US |