发明名称 SENSOR DEVICE, INPUT DEVICE, AND ELECTRONIC APPARATUS
摘要 The sensor device includes a first conductive layer, a second conductive layer, an electrode substrate, a first support, and a second support. The first conductive layer is formed to be deformable sheet-shaped. The second conductive layer is disposed to be opposed to the first conductive layer. The electrode substrate includes multiple first electrode wires and multiple second electrode wires and is disposed to be deformable between the first conductive layer and the second conductive layer, the multiple second electrode wires being disposed to be opposed to the multiple first electrode wires and intersecting with the multiple first electrode wires. The first support includes multiple first structures, the multiple first structures connecting the first conductive layer and the electrode substrate. The second support includes multiple second structures, the multiple second structures connecting the second conductive layer and the electrode substrate.
申请公布号 US2015363023(A1) 申请公布日期 2015.12.17
申请号 US201314763657 申请日期 2013.12.06
申请人 Sony Corporation 发明人 Kawaguchi Hiroto;Shinkai Shogo;Tsukamoto Kei;Katsuhara Tomoko;Hasegawa Hayato;Iida Fumihiko;Tanaka Takayuki;Suzuki Tomoaki;Nishimura Taizo;Mizuno Hiroshi;Abe Yasuyuki
分类号 G06F3/044;G06F3/041;G06F3/047 主分类号 G06F3/044
代理机构 代理人
主权项 1. A sensor device, comprising: a deformable sheet-shaped first conductive layer; a second conductive layer that is disposed to be opposed to the first conductive layer; an electrode substrate that includes multiple first electrode wires and multiple second electrode wires and is disposed to be deformable between the first conductive layer and the second conductive layer, the multiple second electrode wires being disposed to be opposed to the multiple first electrode wires and intersecting with the multiple first electrode wires; a first support that includes multiple first structures, the multiple first structures connecting the first conductive layer and the electrode substrate; and a second support that includes multiple second structures, the multiple second structures connecting the second conductive layer and the electrode substrate.
地址 Tokyo JP