发明名称 FLUID HANDLING DEVICE
摘要 A fluid handling device includes a substrate, a film and a conductive layer. The substrate includes a through hole or a recess. The film includes first, second and third regions. The conductive layer is disposed on one surface of the film across the first, second and third regions. The first region of the film is bonded to one surface of the substrate such that one of openings of the through hole or an opening of the recess is closed to form a housing part, and that a part of the conductive layer is exposed to the inside of the housing part. The second region of the film is bent such that the conductive layer is located on an outside. The third region of the film is bonded to the first region of the film such that the conductive layer is exposed to the exterior.
申请公布号 US2015360223(A1) 申请公布日期 2015.12.17
申请号 US201514731491 申请日期 2015.06.05
申请人 Enplas Corporation 发明人 ONO Koichi;KITAMOTO Ken
分类号 B01L3/00 主分类号 B01L3/00
代理机构 代理人
主权项 1. A fluid handling device comprising: a substrate including a through hole or a recess; a film including a first region, a second region adjacent to the first region and a third region adjacent to the second region; and a conductive layer disposed on one surface of the film across the first region, the second region and the third region, the conductive layer being configured to conduct electricity or heat, wherein the first region of the film is bonded to one surface of the substrate such that one of openings of the through hole or an opening of the recess is closed to form a housing part for housing liquid, and that a part of the conductive layer is exposed to an inside of the housing part, the second region of the film is bent such that the conductive layer is located on an outside, and the third region of the film is bonded to the first region of the film such that the conductive layer is exposed to an exterior.
地址 Saitama JP