发明名称 PROCESS FOR PREPARATION OF HIGH TEMPERATURE, HIGH STRENGTH AND HIGH CONDUCTIVITY DISPERSION STRENGTHENED COPPER ALLOY
摘要 A process for preparation of a high temperature, high strength and high conductivity dispersion strengthened copper alloy. The alloy contains 0.15%-0.65% of aluminum by mass percentage, and the mass ratio of oxygen to aluminum is 1:1.2. The total content of impurities is less than 0.2%, and the balance of copper. A Cu-Al alloy powder is prepared by using a water mist method. Pure copper powder is used as an oxidizing agent after being fully oxidized, and the oxidizing agent and the aluminum in the alloy powder are mixed uniformly in moles ratio (1.18-2.1):1. The mixed powder is inner-oxidized in a nitrogen atmosphere, and then reduced in a reducing atmosphere. The reduced Cu-Al alloy powder is placed into a steel mold to be pressed to a green body, and then is sintered. The sintered billet is placed into the steel mold again to be cold repressed, and then a second annealing is performed followed by a second cold repressing. Finally, the dispersion strengthened copper alloy is obtained by a hot repressing. The dispersion strengthened copper alloy prepared by the present invention has high density, good electrical conductivity, ability to be prepared in a large size, and low production cost reduced 20% or more than the traditional internal oxidation method.
申请公布号 WO2015188378(A1) 申请公布日期 2015.12.17
申请号 WO2014CN79860 申请日期 2014.06.13
申请人 HUNAN TERRY NEW MATERIALS COMPANY LTD. 发明人 HUANG, JINSONG;LIU, BIN;LI, WEI;ZHANG, ZHONGLING;GAN, ZIYANG;XIA, ZIHANG;JIANG, JINCHENG;ZHANG, SIQI
分类号 C22C1/05;C22C9/01;C22F1/08;H01B1/02 主分类号 C22C1/05
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