| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip electronic component capable of minimizing direct current resistance, and a board for mounding the chip electronic component.SOLUTION: A chip electronic component includes: a magnetic material body including an insulating substrate and coil conductor patterns 42 formed on at least one surface of the insulating substrate; and external electrodes formed on both end portions of the magnetic material body so as to be connected to end portions of the coil conductor patterns 42, respectively. The coil conductive patterns 42 are formed by plating, and, in a cross section of the magnetic material body in a length direction, a ratio of a width of the outermost coil conductive pattern among the coil conductive patterns to a width of an inner side coil conductive pattern satisfies 1.0-1.5. |
