| 摘要 |
PROBLEM TO BE SOLVED: To provide a laser processing method, a laser processing head and a laser processing device capable of reliably performing dropping of cut pieces produced in a hole when performing laser processing of the hole onto a planar workpiece.SOLUTION: In a laser processing method for performing hole processing onto a planar workpiece, piercing processing P is performed into an area of a hole H, thereafter, laser cutting processing is performed along a contour of the hole, dictation to a laser cutting processing position from a plurality of side nozzles 5 provided on the circumference of a laser nozzle 3 on a laser processing head 1 is performed, and side gas for causing cut pieces S after the laser cutting processing to drop is ejected. Therein, an ejection pressure to be ejected in a laser cutting processing position direction from the side nozzles 5 located on the outside of the hole is set to be larger than an ejection pressure of the side gas to be ejected in the laser cutting processing position direction from the side nozzle 5 located on the inside of the hole H. |
