| 发明名称 |
A Method Of Encapsulating An Electric Component |
| 摘要 |
An encapsulated electronic assembly comprises an electronic component and a foamed thermoplastic shell disposed about the electronic component. The foamed thermoplastic shell is formed from a thermoplastic encapsulant comprising a thermoplastic resin and a filler and is foamed with a foaming agent. A method of encapsulating the electronic component to form the encapsulated electronic assembly is also provided. The method includes the steps of melting the thermoplastic encapsulant, foaming the thermoplastic encapsulant, and injection molding the foamed thermoplastic encapsulant about the electronic component to form the foamed thermoplastic shell. |
| 申请公布号 |
US2015366076(A1) |
申请公布日期 |
2015.12.17 |
| 申请号 |
US201414760605 |
申请日期 |
2014.01.13 |
| 申请人 |
BASF SE |
发明人 |
Colwell Harold;Balke Inga Marie;Dombrowski Lee Ann;Lair Richard J.;Lange David M.;Wilms Axel |
| 分类号 |
H05K3/28;H05K1/18;B29C44/12;B29C45/14;B29C45/00 |
主分类号 |
H05K3/28 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of encapsulating an electronic component with a thermoplastic encapsulant to form an encapsulated electronic assembly which comprises a foamed thermoplastic shell disposed about the electronic component, said method comprising the steps of:
melting the thermoplastic encapsulant comprising a thermoplastic resin and a filler; foaming the thermoplastic encapsulant; and injection molding the foamed thermoplastic encapsulant about the electronic component to form the foamed thermoplastic shell. |
| 地址 |
Ludwigshafen DE |
