PREPARATION METHOD FOR DRY FILM SOLDER RESIST AND FILM LAMINATE USED THEREIN

摘要

The present invention relates to a preparation method for a dry film solder resist (DFSR) capable of forming the DFSR having fine unevenness on a surface by a more simplified method, and a film laminate used therein. The preparation method for a dry film solder resist includes forming a predetermined photo-curable and heat-curable resin composition on a transparent carrier film having a surface on which a fine unevenness having an average roughness (Ra) of 200 nm to 2 μm is formed; laminating the resin composition on a substrate to form a laminated structure in which the substrate, the resin composition, and the transparent carrier film are sequentially formed; exposing the resin composition and delaminating the transparent carrier film; and alkaline-developing the resin composition in a non-exposure part and performing heat-curing.

主权项

1. A preparation method for a dry film solder resist (DFSR), comprising:
forming a photo-curable and heat-curable resin composition on a transparent carrier film having a surface on which a fine unevenness having an average roughness (Ra) of 50 nm to 5 μm is formed, the resin composition including (a) an acid-modified oligomer having a carboxyl group (—COOH) and a photo-curable unsaturated functional group, (b) a photopolymerizable monomer having two or more photo-curable unsaturated functional groups, (c) a heat-curable binder having a heat-curable functional group, and (d) a photoinitiator; laminating the resin composition on a substrate to form a laminated structure in which the substrate, the resin composition, and the transparent carrier film are sequentially formed; exposing the resin composition and delaminating the transparent carrier film; and alkaline-developing the resin composition in a non-exposure part and performing heat-curing.