| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat dissipation structure of a substrate element, in which all of substrate elements to be mounted on a substrate can be brought into close contact evenly with a heat dissipation plate to be connected to each other.SOLUTION: A heat dissipation structure of a substrate element 4 to be mounted on a substrate 1 includes: an element holding part 2 mounted on the substrate 1 and including a holding part 21 for holding one or two substrate elements 4 formed thereto; a fixture 3 mounted to the holding part 21; a substrate element 4 mounted on the fixture 3 of the holding part 21; and a heat dissipation plate 5 mounted on the substrate element 4. The heat dissipation plate 5 is fixed to the element holding part 2, the heat dissipation plate 5 and the fixture 3 are fastened by a fixture fastening screw 62, and thereby the substrate element 4 is brought into close contact with the heat dissipation plate 5 to be connected to each other. |
