PROTECTIVE COATINGS FOR ELECTRONIC DEVICES AND ATOMIC LAYER DEPOSITION PROCESSES FOR FORMING THE PROTECTIVE COATINGS

摘要

A protective coating for an electronic device, such as a coating that is substantially impermeable to moisture and oxygen, comprises an ultra-thin film comprising a plurality of sub-layers formed by atomic layer deposition (ALD) processes. Low temperature ALD processes may be used to form the sub-layers of the protective coating. The density of the protective film may be enhanced with energy, to which the protective coating or sub-layers thereof may be exposed during deposition or intermittently during the deposition process. ALD apparatuses that are equipped to perform the disclosed processes are also disclosed, as are electronic devices that include the disclosed protective coatings.

主权项

1. An atomic layer deposition process, comprising:
introducing a substrate into a reaction chamber of an atomic layer deposition (ALD) apparatus; introducing reactants into the reaction chamber at a temperature of 150° C. or less to enable a product to be formed as a film on the substrate; and with the substrate in the reaction chamber, exposing the substrate or the film to energy.