| 发明名称 |
PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF |
| 摘要 |
A package structure is provided, which includes: a substrate having opposite first and second surfaces; at least an electronic element disposed on the first surface of the substrate; and an encapsulant formed on the first surface of the substrate for encapsulating the electronic element. The encapsulant has a non-rectangular shape so as to reduce an ineffective space in the encapsulant. |
| 申请公布号 |
US2015366085(A1) |
申请公布日期 |
2015.12.17 |
| 申请号 |
US201414564180 |
申请日期 |
2014.12.09 |
| 申请人 |
Siliconware Precision Industries Co., Ltd. |
发明人 |
Shih Chi-Liang;Chung Hsin-Lung;Chu Te-Fang;Fang Hao-Ju;Chung Kuang-Neng |
| 分类号 |
H05K5/00;H05K1/11;H05K13/00;H05K1/18 |
主分类号 |
H05K5/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A package structure, comprising:
a substrate having opposite first and second surfaces; at least an electronic element disposed on the first surface of the substrate; and an encapsulant formed on the first surface of the substrate for encapsulating the electronic element, wherein the encapsulant has a non-rectangular shape. |
| 地址 |
Taichung TW |
