发明名称 FLUID EJECTION CHIP INCLUDING HYDROPHILIC AND HYDROPHOPIC SURFACES AND METHODS OF FORMING THE SAME
摘要 A fluid ejection chip and associated methods of forming are disclosed. According to an exemplary embodiment, the fluid ejection chip comprises a substrate, a flow feature layer, and a nozzle layer. The flow feature layer is disposed over the substrate and has an exposed hydrophilic surface layer with an ink contact angle of about 80 degrees. The nozzle layer is disposed over the flow feature layer and has a thickness of about 4 microns to about 8 microns and an exposed hydrophobic surface layer having an ink contact angle of about 115 degrees.
申请公布号 US2015360466(A1) 申请公布日期 2015.12.17
申请号 US201414303047 申请日期 2014.06.12
申请人 Funai Electric Co., Ltd. 发明人 Graham David C.;Rhine David B.;Weaver Sean T.;Craft Christopher A.
分类号 B41J2/14;C23C16/44;C23C14/34;C23C16/455;C23C16/50;B05D1/00;C23C14/22 主分类号 B41J2/14
代理机构 代理人
主权项 1. A fluid ejection chip, comprising: a substrate; a flow feature layer disposed over the substrate and having an exposed hydrophilic surface layer with an ink contact angle of about 80 degrees; and a nozzle layer disposed over the flow feature layer and having a thickness of about 4 microns to about 8 microns, the nozzle layer having an exposed hydrophobic surface layer, the exposed hydrophobic surface layer having an ink contact angle of about 115 degrees.
地址 Osaka JP