发明名称 |
SURFACE ENCAPSULATION FOR WAFER BONDING |
摘要 |
Techniques are disclosed for wafer bonding with an encapsulation layer. A first semiconductor substrate is provided. An encapsulation layer is then formed on top of the first semiconductor substrate. The encapsulation layer is formed of an encapsulation material that creates a stable oxide when exposed to an oxidizing agent. A first bonding layer is formed on top of the encapsulation layer. Next, a second semiconductor substrate is provided. A second bonding layer is formed on top of the second bonding layer. Thereafter, the first semiconductor substrate is bonded to the second semiconductor substrate by attaching the first bonding layer to the second bonding layer. |
申请公布号 |
WO2015191082(A1) |
申请公布日期 |
2015.12.17 |
申请号 |
WO2014US42316 |
申请日期 |
2014.06.13 |
申请人 |
INTEL CORPORATION |
发明人 |
JUN, KIMIN;RACHMADY, WILLY;GLASS, GLENN;MURTHY, ANAND |
分类号 |
H01L21/56 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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