发明名称 MINIATURIZED IMAGING APPARATUS FOR WAFER EDGE
摘要 Disclosed are methods and apparatus for imaging a rounded edge of a sample, such as a wafer with a beveled edge. In one embodiment, the system includes a curved diffuser having an internal surface for positioning towards the rounded edge of the sample and an external surface opposite the internal surface and light sources for generating a plurality of illumination beams adjacent to a plurality of positions on the external surface of the diffuser so that the diffuser outputs uniform light onto the rounded edge of the sample at a wide range of incident angles. The system further includes a sensor for receiving light scattered from the rounded edge of the sample in response to the incident light and generating a detected signal for generating an image. These elements are partially or entirely integrated into a compact assembly.
申请公布号 WO2015191620(A1) 申请公布日期 2015.12.17
申请号 WO2015US34952 申请日期 2015.06.09
申请人 KLA-TENCOR CORPORATION 发明人 HORN, PAUL
分类号 H01L21/66 主分类号 H01L21/66
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